2UUL Double Sides Strong Desoldering Wick For Mobile Phone Repair
Option:
1. 2UUL DW16 2015: 2.0mm width.
2. 2UUL DW17 1515: 1.5mm width.
3. 2UUL DW18 2515: 2.5mm width.
4. 2UUL DW19 3015: 3.0mm width.
Features:
1. Employs Ultra Density precision braiding technology, enhancing capillary adhesion and thermal conductivity, allowing solder to be quickly absorbed, improving overall rework speed.
2. High thermal conductivity metal fiber structure quickly removes excess solder, reducing heating time and lowering the risk of pad damage.
3. Optimized front-end structure design prevents the desoldering tape from loosening or fraying, allowing for more precise operation and making it suitable for micro-solder joints and delicate repair scenarios.
4. Available in four sizes: 1515, 2015, 2515, and 3015, allowing for flexible selection based on pad size and repair needs, covering everything from fine to large-area cleaning.
5. 10-roll independent packaging design, moisture-proof, oxidation-proof, and cleaner, suitable for batch use, workshops, and professional repair environments.
6. Specifically optimized for mobile phone motherboard, chip-level repair, and BGA rework, offering high stability and suitability for high-frequency, high-intensity repair workflows.
Product Parameters
Brand: 2UUL
Product Name: Solder Vampire Ultra Density Desoldering Wick
Specifications: 1515/2015/2515/3015
Packaging: 10 Rolls/Box (Individually Wrapped)
Single Roll Length: ≈1.5 m
Product Dimensions: 46x46x12 mm
Packaging Dimensions: 114x77x75 mm
Product Number: 2015-DW16/1515-DW17/2515-DW18/3015-DW19
Gross Weight:
· 1515: 90g
· 2015: 96g
· 2515: 104g
· 3015: 114g
Option:
1. 2UUL DW16 2015: 2.0mm width.
2. 2UUL DW17 1515: 1.5mm width.
3. 2UUL DW18 2515: 2.5mm width.
4. 2UUL DW19 3015: 3.0mm width.
Features:
1. Employs Ultra Density precision braiding technology, enhancing capillary adhesion and thermal conductivity, allowing solder to be quickly absorbed, improving overall rework speed.
2. High thermal conductivity metal fiber structure quickly removes excess solder, reducing heating time and lowering the risk of pad damage.
3. Optimized front-end structure design prevents the desoldering tape from loosening or fraying, allowing for more precise operation and making it suitable for micro-solder joints and delicate repair scenarios.
4. Available in four sizes: 1515, 2015, 2515, and 3015, allowing for flexible selection based on pad size and repair needs, covering everything from fine to large-area cleaning.
5. 10-roll independent packaging design, moisture-proof, oxidation-proof, and cleaner, suitable for batch use, workshops, and professional repair environments.
6. Specifically optimized for mobile phone motherboard, chip-level repair, and BGA rework, offering high stability and suitability for high-frequency, high-intensity repair workflows.
Product Parameters
Brand: 2UUL
Product Name: Solder Vampire Ultra Density Desoldering Wick
Specifications: 1515/2015/2515/3015
Packaging: 10 Rolls/Box (Individually Wrapped)
Single Roll Length: ≈1.5 m
Product Dimensions: 46x46x12 mm
Packaging Dimensions: 114x77x75 mm
Product Number: 2015-DW16/1515-DW17/2515-DW18/3015-DW19
Gross Weight:
· 1515: 90g
· 2015: 96g
· 2515: 104g
· 3015: 114g
Original: $0.99
-65%$0.99
$0.35Description
Option:
1. 2UUL DW16 2015: 2.0mm width.
2. 2UUL DW17 1515: 1.5mm width.
3. 2UUL DW18 2515: 2.5mm width.
4. 2UUL DW19 3015: 3.0mm width.
Features:
1. Employs Ultra Density precision braiding technology, enhancing capillary adhesion and thermal conductivity, allowing solder to be quickly absorbed, improving overall rework speed.
2. High thermal conductivity metal fiber structure quickly removes excess solder, reducing heating time and lowering the risk of pad damage.
3. Optimized front-end structure design prevents the desoldering tape from loosening or fraying, allowing for more precise operation and making it suitable for micro-solder joints and delicate repair scenarios.
4. Available in four sizes: 1515, 2015, 2515, and 3015, allowing for flexible selection based on pad size and repair needs, covering everything from fine to large-area cleaning.
5. 10-roll independent packaging design, moisture-proof, oxidation-proof, and cleaner, suitable for batch use, workshops, and professional repair environments.
6. Specifically optimized for mobile phone motherboard, chip-level repair, and BGA rework, offering high stability and suitability for high-frequency, high-intensity repair workflows.
Product Parameters
Brand: 2UUL
Product Name: Solder Vampire Ultra Density Desoldering Wick
Specifications: 1515/2015/2515/3015
Packaging: 10 Rolls/Box (Individually Wrapped)
Single Roll Length: ≈1.5 m
Product Dimensions: 46x46x12 mm
Packaging Dimensions: 114x77x75 mm
Product Number: 2015-DW16/1515-DW17/2515-DW18/3015-DW19
Gross Weight:
· 1515: 90g
· 2015: 96g
· 2515: 104g
· 3015: 114g
