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AMAOE BGA Stencils for iPhone 7–17 Pro Max Motherboard Swapping

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AMAOE BGA Stencils for iPhone 7–17 Pro Max Motherboard Swapping

AMAOE iPhone Motherboard Swapping Reballing Stencils for iPhone 6-17 Pro Max Baseband, CPU, Nand chips, WIFI IC, NFC and EEPROM chips reballing and soldering. Suitable for iPhone motherboard repair, iPhone iCloud ID motherboard swapping, and iPhone chips replacement repair.


Options:
AMAOE IPBB:1 BGA stencil (Half-carved version): for iPhone 7-16 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:2 BGA stencil (Full-carved version): for iPhone 7-16 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:3 BGA stencil (Half-carved version): for iPhone XS-17 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:3 BGA stencil (Full-carved version): for iPhone XS-17 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE BB:1 BGA stencil (0.1mm): for iPhone 6-15 Pro Max Baseband.
AMAOE BB:2 BGA stencil (0.12mm): for iPhone 7-15 Pro Max Baseband, Nand chip, WIFI, NFC, EEPROM.
AMAOE U-APU:7 BGA stencil (Half-carved version): for Apple A10 A11 A12 A13 A14 A15 A16 A17 CPU.
AMAOE U-APU:8 BGA stencil (Full-carved version): for Apple A10 A11 A12 A13 A14 A15 A16 A17 CPU.
AMAOE U-APU:9 BGA stencil: for Apple A16 A17 A18 A18Pro CPU and RAM.
AMAOE U-APU:10 BGA stencil (Half-carved version): for Apple SE2-A15, A18, A18 Pro, A19, A19 Pro CPU.

Features:
1. Patented precision aperture design with an anti-bulging structure, enhancing the stability and success rate of reballing.
2. Covers all modules—CPU, Baseband, Wi-Fi, and NAND—making it compatible with the repair of multiple generations of iPhone motherboards.
3. Available in two process versions—Semi-Etched and Through-Etched—to accommodate varying repair preferences and precision requirements.
4. High-precision 0.10–0.12mm steel stencil, ideal for the intricate reballing of high-density BGA chips.

AMAOE iPhone Motherboard Swapping Reballing Stencils for iPhone 6-17 Pro Max Baseband, CPU, Nand chips, WIFI IC, NFC and EEPROM chips reballing and soldering. Suitable for iPhone motherboard repair, iPhone iCloud ID motherboard swapping, and iPhone chips replacement repair.


Options:
AMAOE IPBB:1 BGA stencil (Half-carved version): for iPhone 7-16 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:2 BGA stencil (Full-carved version): for iPhone 7-16 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:3 BGA stencil (Half-carved version): for iPhone XS-17 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:3 BGA stencil (Full-carved version): for iPhone XS-17 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE BB:1 BGA stencil (0.1mm): for iPhone 6-15 Pro Max Baseband.
AMAOE BB:2 BGA stencil (0.12mm): for iPhone 7-15 Pro Max Baseband, Nand chip, WIFI, NFC, EEPROM.
AMAOE U-APU:7 BGA stencil (Half-carved version): for Apple A10 A11 A12 A13 A14 A15 A16 A17 CPU.
AMAOE U-APU:8 BGA stencil (Full-carved version): for Apple A10 A11 A12 A13 A14 A15 A16 A17 CPU.
AMAOE U-APU:9 BGA stencil: for Apple A16 A17 A18 A18Pro CPU and RAM.
AMAOE U-APU:10 BGA stencil (Half-carved version): for Apple SE2-A15, A18, A18 Pro, A19, A19 Pro CPU.

Features:
1. Patented precision aperture design with an anti-bulging structure, enhancing the stability and success rate of reballing.
2. Covers all modules—CPU, Baseband, Wi-Fi, and NAND—making it compatible with the repair of multiple generations of iPhone motherboards.
3. Available in two process versions—Semi-Etched and Through-Etched—to accommodate varying repair preferences and precision requirements.
4. High-precision 0.10–0.12mm steel stencil, ideal for the intricate reballing of high-density BGA chips.

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Original: $1.99

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AMAOE BGA Stencils for iPhone 7–17 Pro Max Motherboard Swapping—

$1.99

$0.70

Description

AMAOE iPhone Motherboard Swapping Reballing Stencils for iPhone 6-17 Pro Max Baseband, CPU, Nand chips, WIFI IC, NFC and EEPROM chips reballing and soldering. Suitable for iPhone motherboard repair, iPhone iCloud ID motherboard swapping, and iPhone chips replacement repair.


Options:
AMAOE IPBB:1 BGA stencil (Half-carved version): for iPhone 7-16 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:2 BGA stencil (Full-carved version): for iPhone 7-16 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:3 BGA stencil (Half-carved version): for iPhone XS-17 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE IPBB:3 BGA stencil (Full-carved version): for iPhone XS-17 Pro Max board swapping: including baseband, CPU, Nand flash chip, WiFi IC, NFC chips and EEPROM IC.
AMAOE BB:1 BGA stencil (0.1mm): for iPhone 6-15 Pro Max Baseband.
AMAOE BB:2 BGA stencil (0.12mm): for iPhone 7-15 Pro Max Baseband, Nand chip, WIFI, NFC, EEPROM.
AMAOE U-APU:7 BGA stencil (Half-carved version): for Apple A10 A11 A12 A13 A14 A15 A16 A17 CPU.
AMAOE U-APU:8 BGA stencil (Full-carved version): for Apple A10 A11 A12 A13 A14 A15 A16 A17 CPU.
AMAOE U-APU:9 BGA stencil: for Apple A16 A17 A18 A18Pro CPU and RAM.
AMAOE U-APU:10 BGA stencil (Half-carved version): for Apple SE2-A15, A18, A18 Pro, A19, A19 Pro CPU.

Features:
1. Patented precision aperture design with an anti-bulging structure, enhancing the stability and success rate of reballing.
2. Covers all modules—CPU, Baseband, Wi-Fi, and NAND—making it compatible with the repair of multiple generations of iPhone motherboards.
3. Available in two process versions—Semi-Etched and Through-Etched—to accommodate varying repair preferences and precision requirements.
4. High-precision 0.10–0.12mm steel stencil, ideal for the intricate reballing of high-density BGA chips.