🎉 Up to 70% Off Selected ItemsShop Sale
HomeStore

i2C Chip Prying & IC Glue Removal Blade Kit for Mobile Phone Repair

Product image 1
1 / 5

i2C Chip Prying & IC Glue Removal Blade Kit for Mobile Phone Repair

The blade set includes S1, S2, S3, and S4 four different types of blades for various tasks in mobile phone repair, such as chip delamination, prying, and PCB IC glue removal. Made from premium high-carbon spring steel, these meticulously handcrafted and polished blades offer exceptional hardness, toughness, and resistance to high temperatures and corrosion, making them ideal for chip removal, adhesive removal, delamination, and precision repair operations.


Feature:
1. Constructed from high-carbon spring steel, offering high strength, excellent toughness, and superior wear resistance for long-lasting durability.
2. Exhibits high-temperature and corrosion-resistant properties, making it suitable for frequent, long-term professional repair use.
3. Purely handcrafted with fine grinding and polishing; the razor-sharp edges ensure precise and stable operation.
4. Designed as a multi-specification blade set to meet a diverse range of chip repair and disassembly requirements.

Option:
1. S1 Blade: for chip delamination (1.5mm)
2. S2 Blade: for chip prying (2.5mm)
3. S3 Blade: for chip glue removal.
4. S4 B;ade: for chip edge glue cutting.
5. S1+S2+S3+S4 (Complete Set)

The blade set includes S1, S2, S3, and S4 four different types of blades for various tasks in mobile phone repair, such as chip delamination, prying, and PCB IC glue removal. Made from premium high-carbon spring steel, these meticulously handcrafted and polished blades offer exceptional hardness, toughness, and resistance to high temperatures and corrosion, making them ideal for chip removal, adhesive removal, delamination, and precision repair operations.


Feature:
1. Constructed from high-carbon spring steel, offering high strength, excellent toughness, and superior wear resistance for long-lasting durability.
2. Exhibits high-temperature and corrosion-resistant properties, making it suitable for frequent, long-term professional repair use.
3. Purely handcrafted with fine grinding and polishing; the razor-sharp edges ensure precise and stable operation.
4. Designed as a multi-specification blade set to meet a diverse range of chip repair and disassembly requirements.

Option:
1. S1 Blade: for chip delamination (1.5mm)
2. S2 Blade: for chip prying (2.5mm)
3. S3 Blade: for chip glue removal.
4. S4 B;ade: for chip edge glue cutting.
5. S1+S2+S3+S4 (Complete Set)

Select Brand
Select Option
From $0.99
i2C Chip Prying & IC Glue Removal Blade Kit for Mobile Phone Repair—
$0.99

Description

The blade set includes S1, S2, S3, and S4 four different types of blades for various tasks in mobile phone repair, such as chip delamination, prying, and PCB IC glue removal. Made from premium high-carbon spring steel, these meticulously handcrafted and polished blades offer exceptional hardness, toughness, and resistance to high temperatures and corrosion, making them ideal for chip removal, adhesive removal, delamination, and precision repair operations.


Feature:
1. Constructed from high-carbon spring steel, offering high strength, excellent toughness, and superior wear resistance for long-lasting durability.
2. Exhibits high-temperature and corrosion-resistant properties, making it suitable for frequent, long-term professional repair use.
3. Purely handcrafted with fine grinding and polishing; the razor-sharp edges ensure precise and stable operation.
4. Designed as a multi-specification blade set to meet a diverse range of chip repair and disassembly requirements.

Option:
1. S1 Blade: for chip delamination (1.5mm)
2. S2 Blade: for chip prying (2.5mm)
3. S3 Blade: for chip glue removal.
4. S4 B;ade: for chip edge glue cutting.
5. S1+S2+S3+S4 (Complete Set)