LanRui P08 Tin Explosion-proof Gasket for Phone CPU IC Soldering
Lanrui P08 Explosion-proof Solder Gasket made of high-temperature resistant ultra-white glass can easily tin-plate mobile phone CPU chips without splattering. Lanrui P08 explosion-proof solder gasket reballing glass effectively prevents uneven solder balls or solder bursting caused by pad oxidation, stencil protrusion, etc., offering strong impact resistance and stability, providing safety protection during the soldering process, and improving mobile phone repair efficiency. Suitable for electronic repair and mobile phone motherboard soldering.
Features:
1. Explosion-proof design: Prevents solder balls from bursting due to stencil bulging, improving soldering safety.
2. Smoother soldering: Reduces splatter and uneven solder points, increasing soldering success rate.
3. Ultra-white glass material: High temperature resistant, impact resistant, durable, and not easily deformed.
4. Effectively solves oxidation problems: Facilitates smooth soldering even with oxidized pads.
5. Compact and lightweight: 20×20mm size, suitable for various soldering scenarios.
Product Parameters
Brand: Lanrui
Product Name: Explosin-Proof Tin Gasket
Product Model: P08
Product Weight: 9g
Product Material: Ultra-clear Glass
Product Dimensions: 20x20x1mm
Packaging Dimensions: 36x16x95mm
Product Function: Prevents solder balls from bursting and splashing due to stencil bulging during soldering.
Lanrui P08 Explosion-proof Solder Gasket made of high-temperature resistant ultra-white glass can easily tin-plate mobile phone CPU chips without splattering. Lanrui P08 explosion-proof solder gasket reballing glass effectively prevents uneven solder balls or solder bursting caused by pad oxidation, stencil protrusion, etc., offering strong impact resistance and stability, providing safety protection during the soldering process, and improving mobile phone repair efficiency. Suitable for electronic repair and mobile phone motherboard soldering.
Features:
1. Explosion-proof design: Prevents solder balls from bursting due to stencil bulging, improving soldering safety.
2. Smoother soldering: Reduces splatter and uneven solder points, increasing soldering success rate.
3. Ultra-white glass material: High temperature resistant, impact resistant, durable, and not easily deformed.
4. Effectively solves oxidation problems: Facilitates smooth soldering even with oxidized pads.
5. Compact and lightweight: 20×20mm size, suitable for various soldering scenarios.
Product Parameters
Brand: Lanrui
Product Name: Explosin-Proof Tin Gasket
Product Model: P08
Product Weight: 9g
Product Material: Ultra-clear Glass
Product Dimensions: 20x20x1mm
Packaging Dimensions: 36x16x95mm
Product Function: Prevents solder balls from bursting and splashing due to stencil bulging during soldering.
Original: $1.39
-65%$1.39
$0.49Description
Lanrui P08 Explosion-proof Solder Gasket made of high-temperature resistant ultra-white glass can easily tin-plate mobile phone CPU chips without splattering. Lanrui P08 explosion-proof solder gasket reballing glass effectively prevents uneven solder balls or solder bursting caused by pad oxidation, stencil protrusion, etc., offering strong impact resistance and stability, providing safety protection during the soldering process, and improving mobile phone repair efficiency. Suitable for electronic repair and mobile phone motherboard soldering.
Features:
1. Explosion-proof design: Prevents solder balls from bursting due to stencil bulging, improving soldering safety.
2. Smoother soldering: Reduces splatter and uneven solder points, increasing soldering success rate.
3. Ultra-white glass material: High temperature resistant, impact resistant, durable, and not easily deformed.
4. Effectively solves oxidation problems: Facilitates smooth soldering even with oxidized pads.
5. Compact and lightweight: 20×20mm size, suitable for various soldering scenarios.
Product Parameters
Brand: Lanrui
Product Name: Explosin-Proof Tin Gasket
Product Model: P08
Product Weight: 9g
Product Material: Ultra-clear Glass
Product Dimensions: 20x20x1mm
Packaging Dimensions: 36x16x95mm
Product Function: Prevents solder balls from bursting and splashing due to stencil bulging during soldering.
