MIJING Z22MAX Reballing Platform/Glue Removal for iPhone Android
MIJING Z22 MAX multifunctional BGA reballing platform and glue removal station for precision CPU chip repair on iPhone 11-17 Pro Max and various Android phones, includes chip tinning soldering and IC adhesive removal functions. MIJING Z22MAX features a magnetic platform for securing BGA stencils and spring-loaded locking mechanism that automatically adapt to various chip specifications such as iPhone CPU A13-A19 Pro, Qualcomm, MediaTek, Kirin, RAM/EMMC, and Exynos, helping mobile phone repair technicians to accurately apply solder paste or remove glue.
Option:
1. Standard set: MIJING Z22MAX platform + iPhone A13-A19Pro CPU stencil.
Features:
1. 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
2. 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
3. Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
4. Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
5. High Compatibility: Universally compatible with the Z21MAX reballing stencil; widely supports A13–A19 Pro CPUs as well as most Android CPUs, enhancing its versatility across various repair tasks.
BGA Reballing Stencil Models:
For iPhone CPU: A13, A14, A15, A16, A17, A18, A18 Pro, A19, A19 Pro.
For Qualcomm/Snapdragon: SM8250-102 small, SM8250-202 large, SM8350, SM8450, SM8550, SM8650, SM7250, SM7325, SM8150, SM8350/8450 RAM, SM8475, SM845, Snapdragon 750G.
For MediaTek/Dimensity: MT6833V, MT6853V, MT6877V, MT6855V, MT6873V/6875V, MT6891Z/6893Z, MT6885Z/6889Z, MT6895Z/8795Z, MT6983Z, MT6989W.
For Kirin/Hisilicon: Hi3670, Hi3680, Hi3690, Hi3690/5G, Hi36A0, Hi6280, Hi6260V100, Hi6260V101, Hi6260V120, Hi6290/L.
For RAM/EMMC: eMMC/eMPC/UFS BGA153, RAM376, RAM436, RAM496, RAM556.
For Exynos: Exynos9610/9611 RAM, Exynos9815/1080, Exynos990, Exynos2100, Exynos2200/E9925, Exynos880/980.
Product Specification:
Brand: MIJING
Model: Z22MAX
Dimensions:
· Overall Unit Dimensions: 134 x 103.5 x 31 mm
· Main Body Dimensions: 111.5 x 81.5 mm
Weight: 263g
Supported Models: A13–A19Pro CPUs and most Android CPUs
Packaging: 1 Unit / Box
MIJING Z22 MAX multifunctional BGA reballing platform and glue removal station for precision CPU chip repair on iPhone 11-17 Pro Max and various Android phones, includes chip tinning soldering and IC adhesive removal functions. MIJING Z22MAX features a magnetic platform for securing BGA stencils and spring-loaded locking mechanism that automatically adapt to various chip specifications such as iPhone CPU A13-A19 Pro, Qualcomm, MediaTek, Kirin, RAM/EMMC, and Exynos, helping mobile phone repair technicians to accurately apply solder paste or remove glue.
Option:
1. Standard set: MIJING Z22MAX platform + iPhone A13-A19Pro CPU stencil.
Features:
1. 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
2. 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
3. Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
4. Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
5. High Compatibility: Universally compatible with the Z21MAX reballing stencil; widely supports A13–A19 Pro CPUs as well as most Android CPUs, enhancing its versatility across various repair tasks.
BGA Reballing Stencil Models:
For iPhone CPU: A13, A14, A15, A16, A17, A18, A18 Pro, A19, A19 Pro.
For Qualcomm/Snapdragon: SM8250-102 small, SM8250-202 large, SM8350, SM8450, SM8550, SM8650, SM7250, SM7325, SM8150, SM8350/8450 RAM, SM8475, SM845, Snapdragon 750G.
For MediaTek/Dimensity: MT6833V, MT6853V, MT6877V, MT6855V, MT6873V/6875V, MT6891Z/6893Z, MT6885Z/6889Z, MT6895Z/8795Z, MT6983Z, MT6989W.
For Kirin/Hisilicon: Hi3670, Hi3680, Hi3690, Hi3690/5G, Hi36A0, Hi6280, Hi6260V100, Hi6260V101, Hi6260V120, Hi6290/L.
For RAM/EMMC: eMMC/eMPC/UFS BGA153, RAM376, RAM436, RAM496, RAM556.
For Exynos: Exynos9610/9611 RAM, Exynos9815/1080, Exynos990, Exynos2100, Exynos2200/E9925, Exynos880/980.
Product Specification:
Brand: MIJING
Model: Z22MAX
Dimensions:
· Overall Unit Dimensions: 134 x 103.5 x 31 mm
· Main Body Dimensions: 111.5 x 81.5 mm
Weight: 263g
Supported Models: A13–A19Pro CPUs and most Android CPUs
Packaging: 1 Unit / Box
Original: $15.59
-65%$15.59
$5.46Description
MIJING Z22 MAX multifunctional BGA reballing platform and glue removal station for precision CPU chip repair on iPhone 11-17 Pro Max and various Android phones, includes chip tinning soldering and IC adhesive removal functions. MIJING Z22MAX features a magnetic platform for securing BGA stencils and spring-loaded locking mechanism that automatically adapt to various chip specifications such as iPhone CPU A13-A19 Pro, Qualcomm, MediaTek, Kirin, RAM/EMMC, and Exynos, helping mobile phone repair technicians to accurately apply solder paste or remove glue.
Option:
1. Standard set: MIJING Z22MAX platform + iPhone A13-A19Pro CPU stencil.
Features:
1. 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
2. 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
3. Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
4. Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
5. High Compatibility: Universally compatible with the Z21MAX reballing stencil; widely supports A13–A19 Pro CPUs as well as most Android CPUs, enhancing its versatility across various repair tasks.
BGA Reballing Stencil Models:
For iPhone CPU: A13, A14, A15, A16, A17, A18, A18 Pro, A19, A19 Pro.
For Qualcomm/Snapdragon: SM8250-102 small, SM8250-202 large, SM8350, SM8450, SM8550, SM8650, SM7250, SM7325, SM8150, SM8350/8450 RAM, SM8475, SM845, Snapdragon 750G.
For MediaTek/Dimensity: MT6833V, MT6853V, MT6877V, MT6855V, MT6873V/6875V, MT6891Z/6893Z, MT6885Z/6889Z, MT6895Z/8795Z, MT6983Z, MT6989W.
For Kirin/Hisilicon: Hi3670, Hi3680, Hi3690, Hi3690/5G, Hi36A0, Hi6280, Hi6260V100, Hi6260V101, Hi6260V120, Hi6290/L.
For RAM/EMMC: eMMC/eMPC/UFS BGA153, RAM376, RAM436, RAM496, RAM556.
For Exynos: Exynos9610/9611 RAM, Exynos9815/1080, Exynos990, Exynos2100, Exynos2200/E9925, Exynos880/980.
Product Specification:
Brand: MIJING
Model: Z22MAX
Dimensions:
· Overall Unit Dimensions: 134 x 103.5 x 31 mm
· Main Body Dimensions: 111.5 x 81.5 mm
Weight: 263g
Supported Models: A13–A19Pro CPUs and most Android CPUs
Packaging: 1 Unit / Box
