Mobile Phone CPU Heatsink Copper Sheet Thermal Conductive Pad
Professional CPU chip heatsink copper sheet thermal conductive pad for mobile phone motherboard CPU reballing repair. 0.1mm 0.3mm 0.5mm copper sheet covers the CPU chip to ensure good heat dissipation of the chip and avoid short circuits with other components. Copper shim heatsink Phone CPU chip thermal pad phone motherboard components heat dissipation copper sheet.
Optional Thicknesses:
1. 12.4*14mm*0.1mm (100pcs).
2. 12.4*14mm*0.3mm (100pcs).
3. 12.4*14mm*0.5mm (100pcs).
Key Features:
Size Compatibility: 12.4mm x 14mm, suitable for mobile phone CPU.
High Thermal Conductivity: Ensures efficient heat transfer, reducing CPU temperature after reballing.
Small Form Factor: Compact and lightweight, perfect for cellphone repairs.
Copper Material: Offers superior heat dissipation.
Wide Application: Compatible with a range of mobile phones (iPhone, Huawei, Xiaomi, Samsung, etc.)
Pure copper heat dissipation sheets are designed to improve the cooling efficiency of mobile phone CPUs, offering excellent thermal conductivity for various Android devices. These custom copper sheets are used with a thermal paste to maximize performance. Ideal for phones such as Huawei, Xiaomi, OnePlus, Redmi, ZTE, Samsung, OPPO, VIVO, and Meizu, these sheets help prevent overheating in critical components like the motherboard and CPU.
Professional CPU chip heatsink copper sheet thermal conductive pad for mobile phone motherboard CPU reballing repair. 0.1mm 0.3mm 0.5mm copper sheet covers the CPU chip to ensure good heat dissipation of the chip and avoid short circuits with other components. Copper shim heatsink Phone CPU chip thermal pad phone motherboard components heat dissipation copper sheet.
Optional Thicknesses:
1. 12.4*14mm*0.1mm (100pcs).
2. 12.4*14mm*0.3mm (100pcs).
3. 12.4*14mm*0.5mm (100pcs).
Key Features:
Size Compatibility: 12.4mm x 14mm, suitable for mobile phone CPU.
High Thermal Conductivity: Ensures efficient heat transfer, reducing CPU temperature after reballing.
Small Form Factor: Compact and lightweight, perfect for cellphone repairs.
Copper Material: Offers superior heat dissipation.
Wide Application: Compatible with a range of mobile phones (iPhone, Huawei, Xiaomi, Samsung, etc.)
Pure copper heat dissipation sheets are designed to improve the cooling efficiency of mobile phone CPUs, offering excellent thermal conductivity for various Android devices. These custom copper sheets are used with a thermal paste to maximize performance. Ideal for phones such as Huawei, Xiaomi, OnePlus, Redmi, ZTE, Samsung, OPPO, VIVO, and Meizu, these sheets help prevent overheating in critical components like the motherboard and CPU.
Original: $3.39
-65%$3.39
$1.19Description
Professional CPU chip heatsink copper sheet thermal conductive pad for mobile phone motherboard CPU reballing repair. 0.1mm 0.3mm 0.5mm copper sheet covers the CPU chip to ensure good heat dissipation of the chip and avoid short circuits with other components. Copper shim heatsink Phone CPU chip thermal pad phone motherboard components heat dissipation copper sheet.
Optional Thicknesses:
1. 12.4*14mm*0.1mm (100pcs).
2. 12.4*14mm*0.3mm (100pcs).
3. 12.4*14mm*0.5mm (100pcs).
Key Features:
Size Compatibility: 12.4mm x 14mm, suitable for mobile phone CPU.
High Thermal Conductivity: Ensures efficient heat transfer, reducing CPU temperature after reballing.
Small Form Factor: Compact and lightweight, perfect for cellphone repairs.
Copper Material: Offers superior heat dissipation.
Wide Application: Compatible with a range of mobile phones (iPhone, Huawei, Xiaomi, Samsung, etc.)
Pure copper heat dissipation sheets are designed to improve the cooling efficiency of mobile phone CPUs, offering excellent thermal conductivity for various Android devices. These custom copper sheets are used with a thermal paste to maximize performance. Ideal for phones such as Huawei, Xiaomi, OnePlus, Redmi, ZTE, Samsung, OPPO, VIVO, and Meizu, these sheets help prevent overheating in critical components like the motherboard and CPU.
