Original TBK 125W multifunctional IC grinding platform.  XLY-002 Chip Grinding Machine For iPhone screen IC/mobile phone camera lens polishing repair. G+OCA Pro XLY-001 grinder for iPhone 11-15 Pro Max screen IC grinding/rear camera outer ring removing repair. 

Option:
1. TBK grinding platform. (it's been discontinued.)
2. XLY-001 chip grinder.
3. XLY-002 Chip Grinding Machine.

Mobile phone motherboard screen IC polishing tool. Outer Iron Ring Motherboard Grinding Machine For Mobile Phone IC Fix, for iPhone 11-15 Pro Max Screen Grinding Removing.

Features:
1. The new multi-functional IC grinder can polish the mobile phone cable IC, motherboard IC, camera frame and back cover glass. Stepless adjustment speed, Dual height limit micrometer, powerful, one machine, simple operation, Size Mini, a good helper for mobile phone maintenance!
2. One machine for multiple grinding mobile phone cable IC, motherboard IC likehead frame and rear cover glass can be polished.
3. Stepless rotation speed control grinding from left to right,the grinding rotation speed is faster and faster.

Specification:
Product Name: Multifunctional IC grinder
Brand: TBK
No Load Speed: 15000-27000r/min
Voltage: 220V
Power: 125W
Product Size: 190*138*260MM
Product Weight: 2.2KG

Operating Instructions:
1. plug in the power cord to power on.
2. measure the height of objects to be polished.
3. adjust the height limit micrometer according to the measured grinding height4.use the mobile positioning magnet to fix the position of the polished object.
5. slide the stepless speed regulating switch and start polishing.
6. when polishing，turn the polishing depth knob to polish the depth.
（when turning to the height limit，the height limit can protect the IC from being damaged）.