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WL HT007 Pre-Heating Soldering Station for iPhone X-16 Pro Max

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WL HT007 Pre-Heating Soldering Station for iPhone X-16 Pro Max

WL HT007 Intelligent Mainboard Layered Soldering Station for iPhone X-17 Pro Max. WL HT007 Preheating Desoldering Station for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max/14/14Pro/14Pro Max/15/15Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/17/Air/17 Pro/17 Pro Max motherboard repair.

Optional:

Option 1: HT007 Heating Soldering Station Standard
Option 2: HT007 Heating Host
Option 3: For iPhone X-11 pro max Pre-Heating groove
Option 4: For iPhone 12-12 pro max Pre-Heating groove
Option 5: For iPhone 13/13Pro Max Mold
Option 6: For iPhone 13Mini/ 13Pro Mold
Option 7: For iPhone 13Mini/ 13Pro Mold
Option 8: For iPhone 14/14Pro/14Pro Max Mold
Option 9: For iPhone 15/15 Plus/15 Pro/15 Pro Max mold.
Option 10: For iPhone 16/16 Plus/16 Pro/16 Pro Max mold.
Option 11: For iPhone 17/17 Air/17 Pro/17 Pro Max mold. (Please note that the iPhone 17 series module do not come with a soldering mesh and can only be used for heating separation and bonding to the motherboard.)

Features:

      1. Support voltage 110V-220V.
      2. Output safe voltage 24V DC high performance intelligent welding station.
      3. The dynamic temperature is displayed in real time by a microcomputer and the eddy current heating system makes the power smaller and the heating efficiency higher.
      4. The resistance heating + electromagnetic induction heating at the same time makes the eddy current heating more powerful.
      5. The optimum precise welding temperature can be calculated in real time by synchronous ambient temperature, which makes the welding work more ideal and convenient.

      Advantage:

      1. Bandung universal welding platform, supporting the use of soldering iron, supporting the expansion of iPhone X-16 Pro Max Layered motherboard, tin planting, bonding. For iPhone 17 series, only motherboard seperation and bonging function.
      2. Heating the central column only! Protect motherboard IC from damage!
      3. Supporting computer control, timely warning of tin melting, customizable time, and soldering iron
      4. Hibernation function, one-click memory temperature function and so on!


      WL HT007 Intelligent Mainboard Layered Soldering Station for iPhone X-17 Pro Max. WL HT007 Preheating Desoldering Station for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max/14/14Pro/14Pro Max/15/15Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/17/Air/17 Pro/17 Pro Max motherboard repair.

      Optional:

      Option 1: HT007 Heating Soldering Station Standard
      Option 2: HT007 Heating Host
      Option 3: For iPhone X-11 pro max Pre-Heating groove
      Option 4: For iPhone 12-12 pro max Pre-Heating groove
      Option 5: For iPhone 13/13Pro Max Mold
      Option 6: For iPhone 13Mini/ 13Pro Mold
      Option 7: For iPhone 13Mini/ 13Pro Mold
      Option 8: For iPhone 14/14Pro/14Pro Max Mold
      Option 9: For iPhone 15/15 Plus/15 Pro/15 Pro Max mold.
      Option 10: For iPhone 16/16 Plus/16 Pro/16 Pro Max mold.
      Option 11: For iPhone 17/17 Air/17 Pro/17 Pro Max mold. (Please note that the iPhone 17 series module do not come with a soldering mesh and can only be used for heating separation and bonding to the motherboard.)

      Features:

          1. Support voltage 110V-220V.
          2. Output safe voltage 24V DC high performance intelligent welding station.
          3. The dynamic temperature is displayed in real time by a microcomputer and the eddy current heating system makes the power smaller and the heating efficiency higher.
          4. The resistance heating + electromagnetic induction heating at the same time makes the eddy current heating more powerful.
          5. The optimum precise welding temperature can be calculated in real time by synchronous ambient temperature, which makes the welding work more ideal and convenient.

          Advantage:

          1. Bandung universal welding platform, supporting the use of soldering iron, supporting the expansion of iPhone X-16 Pro Max Layered motherboard, tin planting, bonding. For iPhone 17 series, only motherboard seperation and bonging function.
          2. Heating the central column only! Protect motherboard IC from damage!
          3. Supporting computer control, timely warning of tin melting, customizable time, and soldering iron
          4. Hibernation function, one-click memory temperature function and so on!


          Select Option
          From $12.60

          Original: $35.99

          -65%
          WL HT007 Pre-Heating Soldering Station for iPhone X-16 Pro Max

          $35.99

          $12.60

          Description

          WL HT007 Intelligent Mainboard Layered Soldering Station for iPhone X-17 Pro Max. WL HT007 Preheating Desoldering Station for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max/14/14Pro/14Pro Max/15/15Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/17/Air/17 Pro/17 Pro Max motherboard repair.

          Optional:

          Option 1: HT007 Heating Soldering Station Standard
          Option 2: HT007 Heating Host
          Option 3: For iPhone X-11 pro max Pre-Heating groove
          Option 4: For iPhone 12-12 pro max Pre-Heating groove
          Option 5: For iPhone 13/13Pro Max Mold
          Option 6: For iPhone 13Mini/ 13Pro Mold
          Option 7: For iPhone 13Mini/ 13Pro Mold
          Option 8: For iPhone 14/14Pro/14Pro Max Mold
          Option 9: For iPhone 15/15 Plus/15 Pro/15 Pro Max mold.
          Option 10: For iPhone 16/16 Plus/16 Pro/16 Pro Max mold.
          Option 11: For iPhone 17/17 Air/17 Pro/17 Pro Max mold. (Please note that the iPhone 17 series module do not come with a soldering mesh and can only be used for heating separation and bonding to the motherboard.)

          Features:

              1. Support voltage 110V-220V.
              2. Output safe voltage 24V DC high performance intelligent welding station.
              3. The dynamic temperature is displayed in real time by a microcomputer and the eddy current heating system makes the power smaller and the heating efficiency higher.
              4. The resistance heating + electromagnetic induction heating at the same time makes the eddy current heating more powerful.
              5. The optimum precise welding temperature can be calculated in real time by synchronous ambient temperature, which makes the welding work more ideal and convenient.

              Advantage:

              1. Bandung universal welding platform, supporting the use of soldering iron, supporting the expansion of iPhone X-16 Pro Max Layered motherboard, tin planting, bonding. For iPhone 17 series, only motherboard seperation and bonging function.
              2. Heating the central column only! Protect motherboard IC from damage!
              3. Supporting computer control, timely warning of tin melting, customizable time, and soldering iron
              4. Hibernation function, one-click memory temperature function and so on!


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