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XZZ Lead Free Tin Paste 138/158/183/199℃ Solder Flux
XZZ Tin Paste 138℃ 158℃ 183℃ 199℃ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.
Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.
Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 138℃ 158℃ 183℃ 199℃ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.
Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.
Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
Select Temperature
From $1.05
Original: $2.99
-65%XZZ Lead Free Tin Paste 138/158/183/199℃ Solder Flux—
$2.99
$1.05Description
XZZ Tin Paste 138℃ 158℃ 183℃ 199℃ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.
Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.
Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
